Spotlight on ultra-precision machining: Overcoming the challenges of processing silicon carbide single crystals

Silicon carbide (SiC) has emerged as a crucial material in the realm of high-end electronics, particularly for applications requiring high thermal conductivity, high hardness, and robust chemical stability. Its application extends to power electronics, high-temperature semiconductors, and cutting-edge devices. However, the processing of SiC substrates presents significant challenges, including the need for precision grinding methods that minimize surface roughness and subsurface damage while managing high processing costs. These challenges have spurred ongoing research to refine grinding techniques and understand the atomic-level damage mechanisms involved in processing SiC. Despite numerous studies on SiC processing, a comprehensive understanding of the latest advancements and their implications for improving manufacturing efficiency remains fragmented. Recent efforts have focused on addressing these gaps by investigating new processing methods and materials to better control the surface and subsurface characteristics of SiC wafers.

Recently, a team of mechanical scientist led by Shang Gao from Dalian University of Technology, China reported a review paper provides a thorough overview of the state-of-the-art in SiC processing. They systematically reviewed the current processing flows for SiC wafers, material removal mechanisms, and processing technologies, and provided guidance on future directions for SiC wafer processing.

The team published their work in Journal of Advanced Manufacturing Science and Technology on August 25, 2024.

“This review provides a thorough analysis of the state-of-the-art methods for SiC processing and identifies key areas where further research is necessary,” said Shang Gao, the corresponding author of the review. “By consolidating current knowledge and outlining future research directions, this work aims to guide the development of more efficient and effective processing techniques for SiC wafers.”

The review article covers various aspects of SiC processing, including different grinding, lapping, and polishing techniques employed in the field. It delves into the mechanisms underlying material removal and highlights the latest technological advancements. The paper also addresses the challenges faced in achieving high-quality SiC wafers and proposes several innovative approaches to overcome these obstacles. Through a comprehensive analysis, the review identifies critical areas requiring further investigation, providing a roadmap for future research efforts.

“This comprehensive review serves as a valuable resource for researchers and practitioners in the field, offering a detailed understanding of the current state of SiC processing and highlighting the critical areas that need further investigation,” Shang Gao added. “Our work aims to push the boundaries of what is currently known and stimulate further advancements in the field.”

Other contributors to the review include Haoxiang Wang, Renke Kang, Zhigang Dong State Key Laboratory of High-performance Precision Manufacturing at Dalian University of Technology, China, Dalian.

This work was supported by the National Key Research and Development Program of China (No. 2022YFB3404304) and the National Natural Science Foundation of China (No. 52375411).

About Author

Shang Gao is a professor and Ph.D. supervisor at the School of Mechanical Engineering, Dalian University of Technology, specializing in high-performance precision manufacturing. He received his Ph.D. in Mechanical Manufacturing and Automation from the same university and completed postdoctoral research at the University of Queensland, Australia. His research focuses on precision and ultra-precision processing of hard and brittle materials, semiconductor device substrates, and complex optical surfaces. He has led numerous national-level projects, published over 70 SCI/EI papers, and holds more than 50 invention patents.

Haoxiang Wang is a PhD student at the School of Mechanical Engineering, Dalian University of Technology, focusing on ultra-precision grinding and theoretical research of semiconductor materials. He has published over 10 papers.

Zhigang Dong is a professor from School of Mechanical Engineering, Dalian University of technology in China and the member of International Institute of Abrasive Technology, Extreme Manufacturing Branch of Chinese Mechanical Engineering Society, focusing on ultraprecision machining and theory regarding the difficult-to-process, especially in gallium nitride for many years. He has published more than 150 papers.

Renke Kang is a professor from School of Mechanical Engineering, Dalian University of technology in China and the member of International Committee of Abrasive Technology, focusing on ultraprecision machining and theory regarding the hard and brittle materials. He has published more than 200 papers.

About Journal of Advanced Manufacturing Science and Technology

Journal of Advanced Manufacturing Science and Technology (JAMST) is an open-access and peer-reviewed journal that was launched by Dalian University of Technology and Engineering Research Center of Advanced Manufacturing Technology for Aero Engine, Ministry of Education, Northwestern Polytechnical University in 2021. The journal is published by Tsinghua University Presss.

About SciOpen 

SciOpen is an open access resource of scientific and technical content published by Tsinghua University Press and its publishing partners. SciOpen provides end-to-end services across manuscript submission, peer review, content hosting, analytics, identity management, and expert advice to ensure each journal’s development. By digitalizing the publishing process, SciOpen widens the reach, deepens the impact, and accelerates the exchange of ideas.