Manufacturing Process and Application Fields of SiC Wafers (IMAGE)

Tsinghua University Press

Manufacturing Process and Application Fields of SiC Wafers

Caption

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value in fields such as satellite communication, microwave radar, 5G, electric vehicles, etc.

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Journal of Advanced Manufacturing Science and Technology, Tsinghua University Press

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