Figure 2. Photographs of a Developed Device (IMAGE)

Tokyo Institute of Technology

Figure 2. Photographs of a Developed Device

Caption

Left; The photo shows a developed high-sensitivity MEMS Accelerometer. The Au proof mass was fabricated on a silicon die. The accelerometer was implemented in a ceramic package and wire-bonded. Right; The SEM images show the close-up views of the Au proof mass and the spring structure. The Au proof-mass structure of 22-μm thickness was successfully developed by employing the M4 and M5 layers. The serpentine spring structure was made of the M3 and M4 layers. The serpentine springs and stoppers were placed at each corner of the proof mass.

Credit

Sensors and Materials, Daisuke Yamane

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