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Popping Materials and Devices in 3-D (5 of 6)

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American Association for the Advancement of Science (AAAS)

Popping Materials and Devices in 3-D (5 of 6)

image: This image shows complex 3-D silicon microstructures formed by compressive buckling. This material relates to a paper that appeared in the 9 Jan. 2015 issue of Science, published by the American Association for the Advancement of Science. The paper, by S. Xu at University of Illinois at Urbana-Champaign in Urbana, IL, and colleagues was titled, 'Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling.' view more 

Credit: J. Rogers, University of Illinois


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