News Release

World Scientific launches new book on CMOS Technology for 5G Future

Book Announcement

World Scientific

CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems

image: Cover for "CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems". view more 

Credit: World Scientific

Launched at the Singapore University of Technology and Design (SUTD) on 24 July 2019, CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems is World Scientific's latest publication for 5G technology, co-authored by Prof Kiat-Seng Yeo (Associate Provost for Research and International Relations, Singapore University of Technology and Design, Singapore), Prof Chirn Chye Boon (Associate Professor, Nanyang Technological University, Singapore), Dr Xiang Yi (Postdoctoral Fellow, Massachusetts Institute of Technology, USA), and Prof Fanyi Meng (Associate Professor, Tianjin University, China).

The concern of power consumption has always been part of the design process but was less visible for millimeter-wave (MMW) integrated circuits and systems. However, due to the explosive growth of mobile devices and 5G connectivity, wireless transmission at greater than one Gigabit-per-second (Gbps) data rates is becoming essential. As a result, the network infrastructure will be endowed with an unprecedented degree of intelligence, integrating with the environment and offering fast, secure, and reliable communications.

It is extremely challenging to achieve Gbps data rate applications below a 6-GHz band due to spectrum scarcity. Therefore, the MMW band has drawn increasing interest over recent years for enabling ultra-high-speed wireless transmission. It will transform the way we live, play, work and travel while delivering more performance, efficiency and comfort as well as provide a huge leap forward in speed, capacity and connectivity.

Combining MMW integrated circuit design and RF System-on-Chip models, this book serves to provide the fundamentals of MMW CMOS technology, together with the advances in the area. Innovative concepts and techniques of new integrated circuit design for developing high performance and low power circuits and systems for present and future wireless communication applications are detailed. The information presented shall be extremely beneficial and valuable to personnel who is already working or about to embark in this interdisciplinary area of wireless communication and semiconductor industry. For the many years to come, high speed wireless connectivity together with the search for even lower power requirements will continue. MMW CMOS technology is the answer for such ever-increasing demand.

CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems retails for US$98 / £85 (hardback). Find out more about the book and its authors on https://www.worldscientific.com/worldscibooks/10.1142/11341.

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About the Authors

Kiat Seng Yeo is Associate Provost for Research and International Relations at the Singapore University of Technology and Design (SUTD). He has about 30 years of experience in industry, academia and consultancy. Before joining SUTD, he was Full Professor at Nanyang Technological University (NTU), Singapore; and spent 13 years in management positions as Associate Chair (Research), Head of Circuits and Systems and Sub-Dean (Students Affairs). Professor Yeo was also a Fellow of the Renaissance Engineering Programme (REP) and served as Senator and Advisory Board Member at NTU. Besides, he was the Founding Director of VIRTUS, a S$50 million IC Design Centre of Excellence jointly set up by NTU and Singapore Economic Development Board. Since 1996, he has been providing consultancy services to statutory boards, local SMEs and multinational corporations in the areas of electronics and IC design. He is author of 9 books, 7 book chapters and has over 600 top-tier refereed journal and conference papers in his area of research and holds 38 patents. Professor Yeo is a Member of Board of Advisors of the Singapore Semiconductor Industry Association and a world-renowned authority on low-power RF/mm-wave IC design and a recognized expert in CMOS technology. He is an IEEE fellow for his contributions to low-power integrated circuit design.

Chirn Chye Boon is currently an Associate Professor at Nanyang Technological University (NTU), Singapore, where he has been since 2005, as well as the Programme Director for RF and MM-wave research in VIRTUS (NTU) since March 2010. Prior to which he was a Senior Engineer at Advanced RFIC. He specializes in the areas of radio frequency (RF) and MM-wave circuits and systems design for Biomedical and Communications applications. He has conceptualized, designed and silicon-verified 84 circuits/chips for biomedical and communication applications. Chirn Chye has published over 100 refereed publications in the fields of RF and MM-wave and is a co-author of the book Design of CMOS RF Integrated Circuits and Systems.

Xiang Yi is currently a Postdoctoral Fellow in Massachusetts Institute of Technology (MIT), USA. Prior to which he was a Research Fellow in NTU from 2014 to 2017. Dr Yi was the recipient of the IEEE ISSCC Silkroad Award and SSCS Travel Grant Award and in 2013. He has published over 40 refereed publications in the fields of RF, mm-Wave, and THz IC design including ISSCC, JSSC, TMTT etc. He is a technical reviewer for several IEEE journals and conferences. His research interests include radio frequency (RF), millimetre-wave (mm-Wave), and Terahertz (THz) frequency synthesizers and transceiver systems.

Fanyi Meng is currently an Associate Professor at Tianjin University, China (TJU), and the Principal Investigator for NSFC Project and Chinese Air-Force Key Component Developing Project. Prior to 2016, Fanyi was a Research Fellow at Nanyang Technological University (NTU), Singapore. He specializes in the areas of radio frequency (RF), mm-Wave, and Terahertz (THz) circuits and systems design for communication and radar applications. He has published over 40 refereed publications in the fields of RFIC and THz technologies, including ISSCC, JSSC, TTHZ, TMTT, TED, etc.

About World Scientific Publishing Co.

World Scientific Publishing is a leading international independent publisher of books and journals for the scholarly, research and professional communities. World Scientific collaborates with prestigious organisations like the Nobel Foundation and US National Academies Press to bring high quality academic and professional content to researchers and academics worldwide. The company publishes about 600 books and over 140 journals in various fields annually. To find out more about World Scientific, please visit http://www.worldscientific.com.

For more information, contact Amanda at heyun@wspc.com.


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