image: FlexTech is a fully open access international journal publishing experimental and theoretical research on flexible technologies with new materials, creative structures, original integrating strategies, innovative fabrication methods, and pioneering applications.
Credit: FlexTech, Tsinghua University Press
On December 9, 2023, the 5th International Conference on Flexible Electronics (ICFE 2023) was held in Hangzhou, China. The international academic journal, FlexTech, was officially inaugurated at this conference.
FlexTech is an initiative led by Tsinghua University, with academic support from the Laboratory of Flexible Electronics Technology Laboratory, Tsinghua University. This journal is co-published by Tsinghua University Press and John Wiley & Sons, Inc.
The editorial board of FlexTech is under the distinguished leadership of Professor Xue Feng from Tsinghua University. The associate editors include Professor Chwee Teck Lim from the National University of Singapore, Professor Young Min Song from the Gwangju Institute of Science and Technology, Republic of Korea, and Professor Kourosh Kalantar-Zadeh from the University of Sydney, Australia. The journal's advisory board members include eminent scholars such as Professor John A. Rogers and Professor Yonggang Huang from Northwestern University, USA.
The launch ceremony was graced by the presence of Ms. Li Zhang, Deputy Director of the Journal Publishing Center of Tsinghua University Press, and Ms. Zhe Liu, Associate Publisher from John Wiley & Sons, Inc., along with several members of the journal's editorial board. The event was hosted by Professor Yihui Zhang from Tsinghua University.
FlexTech is a fully open access international journal publishing experimental and theoretical research on flexible technologies with new materials, creative structures, original integrating strategies, innovative fabrication methods, and pioneering applications. FlexTech is the platform to gather and share inspiring findings and thoughts on emerging flexible technologies that act as the core and foundation for science and engineering.
FlexTech welcomes interdisciplinary research, spanning but not constrained to:
- Advanced materials for flexible devices, soft materials, biomimetic soft materials
- Design of flexible, stretchable, and conformal structures for flexible devices
- Novel manufacturing methodologies for flexible devices and system
- Emerging applications of flexible technologies
- Computational approaches and artificial intelligence for flexible technologies
Journal Features
- Fully Open access: Unrestricted, free access to all published research
- APC waiver: No cost for publishing your findings
- Broad readership: Reaching a wide spectrum of readers, from academia to industry
- Interdisciplinary dialogue: A melting pot for insights across diverse scientific landscapes
Journal Home: https://onlinelibrary.wiley.com/journal/27711714
Submit your manuscript to: https://mc.manuscriptcentral.com/FlexTech
Contact the Editorial Office: flextech@tup.tsinghua.edu.cn