Figure 1 (IMAGE)

Tohoku University

Figure 1

Caption

A schematic of the proposed iPMA-type Hexa-MTJ technology. Hexa-MTJ realizes high thermal stability factor and low resistance for solder reflow capability and a high endurance cycle by developing (i) low RA MgO barrier, (ii) high PMA, iii) small temperature dependence of magnetization in the recording layer, and (iv) stable reference layer.

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IEEE & Tohoku University

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