Device (IMAGE)

Stanford University

Device

Caption

Angled-view photograph of the fully packaged device. The top (mechanical) chip is secured facedown to the bottom (qubit) chip by an adhesive polymer.

Credit

Agnetta Cleland

Usage Restrictions

Credit must be given to the creator. Only noncommercial uses of the work are permitted. No derivatives or adaptations of the work are permitted.

License

CC BY-NC-ND

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