Fig. 1 Photo and Schematic Design (IMAGE) Osaka University Caption Photo and schematic design of the FlexTEG module, photo of Bismuth-telluride (Bi-Te) semiconductor chips, and voltage and power as a function of the current for the FlexTEG module at different temperature gradients. Credit Osaka University Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.