Copper Pillar (1 of 2) (IMAGE) Georgia Institute of Technology Research News Caption Scanning electron microscope image of two copper pillars bonded together using a novel fabrication technique. Placing these all-copper connections between computer chips and external circuitry will lead to increased computing speeds. Credit Image courtesy of Tyler Osborn Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.