Schematic illustration of direct gold bonding on flexible substrates (IMAGE)

RIKEN

Schematic illustration of direct gold bonding on flexible substrates

Caption

(A) Evaporated gold surfaces on 2 μm thick parylene substrates were exposed to water vapor plasma. (B) Bonding of water vapor plasma treated-gold was achieved by overlapping the two substrates and storing them in ambient air for a few seconds to several hours without any applied pressure or heat.

Credit

RIKEN

Usage Restrictions

yes, credit RIKEN

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