Cooling mechanism by two-phase immersion (IMAGE)

Japan Science and Technology Agency

Cooling mechanism by two-phase immersion

Caption

Combination of the grooved heat transfer surface with the lotus copper with high thermal conductivity leads to both the enhancement of boiling heat transfer and the prevention of a film boiling (limit of the boiling heat transfer) (a) Lotus-root-like porous metal with unidirectional pore structure (b) Self liquid supply from the top of the lotus copper is induced by vapor discharge from the grooves

Credit

Lotus Thermal Solution

Usage Restrictions

The image only be used with “Provided by Lotus Thermal Solution Inc.

License

Original content

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