3-D Microstructures (IMAGE)

University of Illinois Grainger College of Engineering

3-D Microstructures

Caption

These are 3D microstructures of device-grade silicon formed using concepts similar to those in children's 'pop-up' books. The images correspond to colorized scanning electron micrographs. The silicon has a thickness of 2 microns. Potential applications range from battery anodes, to solar cells, to 3D electronic circuits and biomedical devices.

Credit

John Rogers, University of Illinois

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