Mechanics Simulations (VIDEO)

University of Illinois Grainger College of Engineering

Caption

These are mechanics simulations and optical micrographs of the assembly of a triple-level 3-D framework made of device-grade silicon, starting from a 2-D grid formed by conventional techniques in semiconductor processing. Controlled compressive buckling induced by a prestretched elastomer substrate lifts the 2-D structure into a 3-D microarchitecture. The color indicates the level of strain in the constituent materials. The silicon has a thickness of 2 microns.

Credit

John Rogers, University of Illinois

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