Trench Capacitors (IMAGE) American Institute of Physics Caption SEMs of the trench capacitor and TSV (thru-substrate via) structures fabricated into the trap chip. These make electrical connections to the trap electrodes while filtering out RF pickup. Credit J. Amini, GTRI and D. Youngner, Honeywell Usage Restrictions This image may be used only with appropriate caption and credit. License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.