Fig. 2 System Overview (IMAGE) Osaka University Caption A piece of flat adhesive sheet. Adhesion is produced by controlling temperature. Arrays of modules stacked on a large substrate. Serial communication. A target temperature and module number are sent to PC to increase adhesion. Credit Osaka University Usage Restrictions None License Licensed content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.