Dry etching area in the Fraunhofer IAF clean room (IMAGE)

Fraunhofer Institute for Applied Solid State Physics

Dry etching area in the Fraunhofer IAF clean room

Caption

As part of the APECS pilot line, the area of dry etching technology in the Fraunhofer IAF clean room for 6’’ wafers is being expanded.

Credit

© Fraunhofer IAF

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