Photo 3-2 (IMAGE) National Research Council of Science & Technology Caption KIMM, the Korea Semiconductor Research Association, Hanwha Precision Machinery Co., Ltd., Cressem Co., Ltd., and MTI Co., Ltd. signed a memorandum of understanding (MOU) for the commercialization of next-generation semiconductor FO-PLP technology on Tuesday, the 26th, at the Ruby Hall of EL Tower in Seoul. From left: Park Sung-kyun, CEO of MTI Co., Ltd.; Oh Sang-min, CEO of Cressem Co., Ltd.; Ryu Seog-hyun, President of KIMM; Park Young-min, Executive Director of Hanwha Precision Machinery Co., Ltd.; and Ahn Ki-hyun, Secretary General of the Korea Semiconductor Research Association. Credit Korea Institute of Machinery and Materials (KIMM) Usage Restrictions The sources of photos and research results from KIMM must be specified. License Original content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.