Beat the Heat with Radiative Cooling (IMAGE)

Institute of Industrial Science, The University of Tokyo

Beat the Heat with Radiative Cooling

Caption

Researchers at The University of Tokyo demonstrate enhanced radiative heat transfer across a gap between two micro-sized silicon plates by coating them with a layer of silicon dioxide, which may significantly improve heat management of computers.

Credit

Institute of Industrial Science, The University of Tokyo

Usage Restrictions

This image may only be used with appropriate credit.

License

Original content

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.