Microstructural characterizations of SS-Cu. (IMAGE)
Caption
a, A scanning electron microscopy image of SS-Cu. b,c, Typical HRTEM images of SS-Cu, revealing abundant stacking faults (b) and grain boundaries (c) with inset atomic-resolution HAADF-STEM images from the area highlighted with a yellow rectangle. The yellow lines in the insets highlight stacking faults and five-fold twin boundaries. d, An atomic-resolution HAADF-STEM image showing stepped faces induced by a stacking fault and a twin boundary, both along {111} planes (dashed white lines). e, GPA strain (ε) mapping on d, showing tensile strain near the surface exits of the stacking fault and the twin boundary, using the lattice far from these defects as a reference (zero strain). The measured strain is perpendicular to the {111} plane along which the stacking fault and twin boundary align.
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