A patterned four-inch GaAs wafer with monocrystalline GaAs/AlGaAs dies that will eventually be fusion-bonded onto the coated silicon substrates. (IMAGE)

University of Vienna

A patterned four-inch GaAs wafer with monocrystalline GaAs/AlGaAs dies that will eventually be fusion-bonded onto the coated silicon substrates.

Caption

A patterned four-inch GaAs wafer with monocrystalline GaAs/AlGaAs dies that will eventually be fusion-bonded onto the coated silicon substrates.

Credit

Georg Winkler

Usage Restrictions

Credit must be given to the creator.

License

CC BY

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