A new technology that allows 3-D electronic circuits to be moulded into plastic objects is set to change the shape of tomorrow's technology by allowing designers much greater freedom and providing excellent weight and space savings. The technology, being developed by Interconnection and Electronics Chemicals in the UK, can be used to produce products that can be assembled with lower production costs than using traditional technologies and are 100 per cent recyclable.
A 3-D framework of copper interconnection patterns is constructed and then plated in a cheap metal foil. The framework is then placed in the mould cavity of an injection moulding machine and molten thermoplastic resin is forced into the cavity against the plated pattern. After cooling, the foil is chemically removed from the moulding, revealing the 3-D moulded circuit. The new materials used in this technology provide sufficient resistance to high temperatures to allow operations such as mass-soldering to be carried out without damage.
Circuits produced by this new process are finding uses in areas such as the aerospace, automotive and military industries. The telecommunications industry has also shown a great interest in this technology for the potential weight reduction in the manufacture of mobile and cordless telephone handsets and also TV or video remote controllers.
PLEASE MENTION MATERIALS WORLD AS THE SOURCE OF THIS ITEM
Notes For Editors
1. This item is due to appear as an article in the October 1999 issue of
Materials World. The article "3-D moulded circuits shaping up well" is written
by Russ Wood. Ref: Materials World, Volume 7, Issue 10, page 621.
2. Materials World is the journal of The Institute of Materials, the
professional organisation of materials scientists, engineers and technicians
working throughout the world in areas involving the use and application of
plastics, rubber, metals, composites and ceramics. Brief contents of Materials
World are also available on the web: www.materials.org.uk
3. The views and opinions expressed in this article are the views of the author
and are not necessarily the views of Materials World, IoM Communications or any
other organisation with which they are associated.
4. Alternative contact: Materials_World@materials.org.uk