Figure 1. (image) Osaka University Share Print E-Mail Caption Si die attach example to a lead frame - Si dies affixed to a lead frame using Ag films after treated at 250 degrees Celsius. Credit Osaka University Usage Restrictions None Share Print E-Mail Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.