Slicing diamonds with laser pulses (IMAGE)

Chiba University

Slicing diamonds with laser pulses

Caption

Focusing the energy of a laser beam into a small volume of a diamond sample creates tiny ‘modified regions.’ If these modified regions are laid out in a precise grid-like pattern, the ensuing cracks make it easy to separate a {100} wafer from the diamond.

Credit

Hirofumi HIDAI from Chiba University

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