Resonant dielectric Mie voids. (IMAGE)

Light Publishing Center, Changchun Institute of Optics, Fine Mechanics And Physics, CAS

Resonant dielectric Mie voids.

Caption

Focused ion beam milling allows to structure conically shaped voids of varying diameter and depth into a bulk silicon wafer. a, The scanning electron microscopy (SEM) image shows a random arrangement of holes of varying diameter and depth. b, In the optical microscope image one can observe the wavelength-dependent resonant scattering from the individual voids. c, Optical microscope image. d, Top view SEM image, e, SEM image focused ion beam cut. f, Sketch of the experimental setups used. The surface of the silicon is illuminated with white light and the reflected light is collected.

Credit

by M. Hentschel, K. Koshelev, F. Sterl, S. Both, J. Karst, L. Shamsafar, T. Weiss, Y. Kivshar, and H. Giessen

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Credit must be given to the creator.

License

CC BY

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