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Light Publishing Center, Changchun Institute of Optics, Fine Mechanics And Physics, CAS

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Caption

Illustration of an active element in the new integrated THz photonics platform, with the laser waveguide embedded in a low-loss BCB polymer and covered with an extended top metallization. The inset shows an electron microscope image (SEM) of a fabricated device that features improved dispersion, RF and thermal properties and can be co-integrated with various passive elements on the same photonic chip.

Credit

by Senica, U., Forrer, A., Olariu, T. et al.

Usage Restrictions

Credit must be given to the creator.

License

CC BY

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