Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals (IMAGE)
Caption
Schematic diagram of surface/subsurface damage and material removal behavior of MgF2 single crystal induced by nanoscratch, and distribution of normalized stress field in YOZ and XOZ planes when brittle removal occurred in scratch process. Median cracks induced by tensile stress initiated and propagated at the front of the indenter during loading process, and lateral cracks induced by tensile stress initiated and propagated on the subsurface during the unloading process. The tensile stress during unloading might cause cleavage fracture of the MgF2 single crystal, inducing the initiation of radial cracks on the workpiece surface.
Credit
By Chen Li, Yinchuan Piao, Feihu Zhang, Yong Zhang, Yuxiu Hu, Yongfei Wang.
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Credit must be given to the creator.
License
CC BY