Efficiencies of the MJSC, HCMJSC and HCSC panels as a function of the bandgap and thermalization coefficient. The novel HCMJSC design, investigated by the researchers, shows higher resilience to nonoptimal bandgaps and less constrained thermalization requirements, widening the scope of candidate materials for its design. (IMAGE)

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Efficiencies of the MJSC, HCMJSC and HCSC panels as a function of the bandgap and thermalization coefficient. The novel HCMJSC design, investigated by the researchers, shows higher resilience to nonoptimal bandgaps and less constrained thermalization requirements, widening the scope of candidate materials for its design.

Caption

Efficiencies of the MJSC, HCMJSC and HCSC panels as a function of the bandgap and thermalization coefficient. The novel HCMJSC design, investigated by the researchers, shows higher resilience to nonoptimal bandgaps and less constrained thermalization requirements, widening the scope of candidate materials for its design.

Credit

Giteau et al., doi 10.1117/1.JPE.12.032208.

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