Incorporation of DMVC-OCF3 and DMVC-OTMS in the VC scaffold (IMAGE)

Ulsan National Institute of Science and Technology(UNIST)

Incorporation of DMVC-OCF3 and DMVC-OTMS in the VC scaffold

Caption

Figure 1. Incorporation of DMVC-OCF3 and DMVC-OTMS in the VC scaffold leads to the creation of a flexible and robust SEI on the Si-C anode. DMVC-OTMS scavenges HF and deactivates PF5, resulting in the compositional and structural stability of the interfacial layers on the electrodes. The Me (?CH3) moiety bonded to the VC scaffold provides ion channels, providing space for Li-ion transport in the SEI.

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UNIST

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