Fracture-Induced Structuring Process (IMAGE)

Princeton University, Engineering School

Fracture-Induced Structuring Process

Caption

Fracture-induced structuring results in the self-formation of periodic lines, or gratings, separated by as few as 60 nanometers -- less than one ten-thousandth of a millimeter -- on microchips. First, a thin polymer film is painted onto a rigid plate, such as a silicon wafer. Then, a second plate is placed on top, creating a polymer sandwich that is heated to ensure adhesion. Finally, the two plates are pried apart. As the film fractures, it automatically breaks into two complementary sets of nanoscale gratings, one on each plate.

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Stephen Chou/Princeton University

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