Figure 1. State-of-the-art 2.5D package design versus 3D functional interposer design (IMAGE)

Tokyo Institute of Technology

Figure 1. State-of-the-art 2.5D package design versus 3D functional interposer design

Caption

The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance. MPU: Microprocessing unit; DRAM: Direct random-access memory.

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The 2021 IEEE Electronic Components and Technology Conference

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