The Wire Bond is Adapted to the Position and Orientation of the Chips. (IMAGE)

Helmholtz Association

The Wire Bond is Adapted to the Position and Orientation of the Chips.

Caption

The wire bond is adapted to the position and orientation of the chips.

Credit

Figure: N. Lindenmann and G. Balthasar

Usage Restrictions

None

License

Licensed content

Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.