Fused silica wafer fabricated by selective laser etching. (IMAGE)

SPIE--International Society for Optics and Photonics

Fused silica wafer fabricated by selective laser etching.

Caption

Fused silica wafer with thickness of 350 um with high-quality glass vias of diameters between 0.25 mm and 6 mm fabricated by selective laser etching. From 10.1117/1.OE.60.2.025105

Credit

Daniel Flamm et al.

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