Slimmer Nanorods Good Fit for Next-Gen 3-D Computer Chips (IMAGE)

Rensselaer Polytechnic Institute

Slimmer Nanorods Good Fit for Next-Gen 3-D Computer Chips

Caption

Researchers at Rensselaer Polytechnic Institute have discovered a new method for growing slimmer copper nanorods, which can be used as a low-temperature bonding agent for holding together the layers of next-generation 3-D integrated computer chips. The researchers found that interrupting the nanorod growth process results in thinner rods. Pictured are scanning electron images, at the same magnification, of copper nanorods that have been grown without interruption (top), with two interruptions (middle), and with six interruptions (bottom).

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Rensselaer/Pei-I Wang

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