Grain Boundary Engineering: Development of a strong and tough CoNiCr alloy (IMAGE)

Songshan Lake Materials Laboratory

Grain Boundary Engineering: Development of a strong and tough CoNiCr alloy

Caption

Pathway to overcome bittlenesss  

Credit

Qingqing Ding and Zhouqing Zhang at Zhejiang University

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Credit must be given to the creator.

License

CC BY

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