SciOpen, an international digital publishing platform for STM journals, unveils new updates. (IMAGE)

Tsinghua University Press

SciOpen, an international digital publishing platform for STM journals, unveils new updates.

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On June 30, 2024, SciOpen 2.0 was officially launched. Developed by Tsinghua University Press, SciOpen initially made its debut in June 2022 as an international digital publishing platform for STM journals. After two years of global operation and continuous iterative upgrades, SciOpen has completed a comprehensive upgrade of its interactive system design and has integrated advanced large-model AI reading capabilities, marking a significant leap forward in its functionality.

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Tsinghua University Press

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