2D material-based electronics (IMAGE) Washington University in St. Louis Caption Schematic illustration of an edge computing system based on monolithic 3D-integrated, 2D material-based electronics. The system stacks different functional layers, including AI computing layers, signal-processing layers and a sensory layer, and integrates them into an AI processor. Credit Sang-Hoon Bae, McKelvey School of Engineering, Washington University in St. Louis Usage Restrictions For editorial purposes License Original content Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.